Jinlin Wang. The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages. Microelectronics Reliability, 47(12):1958-1966, 2007. [doi]
@article{Wang07-12,
title = {The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages},
author = {Jinlin Wang},
year = {2007},
doi = {10.1016/j.microrel.2007.04.016},
url = {http://dx.doi.org/10.1016/j.microrel.2007.04.016},
tags = {data-flow},
researchr = {https://researchr.org/publication/Wang07-12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {12},
pages = {1958-1966},
}