Compact model to efficiently characterize TSV-to-transistor noise coupling in 3D ICs

Hailang Wang, Mohammad H. Asgari, Emre Salman. Compact model to efficiently characterize TSV-to-transistor noise coupling in 3D ICs. Integration, 47(3):296-306, 2014. [doi]

@article{WangAS14-1,
  title = {Compact model to efficiently characterize TSV-to-transistor noise coupling in 3D ICs},
  author = {Hailang Wang and Mohammad H. Asgari and Emre Salman},
  year = {2014},
  doi = {10.1016/j.vlsi.2013.10.006},
  url = {http://dx.doi.org/10.1016/j.vlsi.2013.10.006},
  researchr = {https://researchr.org/publication/WangAS14-1},
  cites = {0},
  citedby = {0},
  journal = {Integration},
  volume = {47},
  number = {3},
  pages = {296-306},
}