Shengcheng Wang, Taeyoung Kim 0001, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori. Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. VLSI Syst., 26(3):531-543, 2018. [doi]
Abstract is missing.