Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

Y. W. Wang, Y. W. Lin, C. R. Kao. Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. Microelectronics Reliability, 49(3):248-252, 2009. [doi]

Authors

Y. W. Wang

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Y. W. Lin

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C. R. Kao

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