Prebond Testing and Test-Path Design for the Silicon Interposer in 2.5-D ICs

Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty. Prebond Testing and Test-Path Design for the Silicon Interposer in 2.5-D ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 36(8):1406-1419, 2017. [doi]

Abstract

Abstract is missing.