A testing method for assessing solder joint reliability of FCBGA packages

Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan. A testing method for assessing solder joint reliability of FCBGA packages. Microelectronics Reliability, 44(5):833-840, 2004. [doi]

Abstract

Abstract is missing.