Zhancheng Wang, Weimin Li, Hang Tong, Yangsheng Xu. A Novel On-board Temperature Monitoring Approach in the Reflow Soldering Process. In 2006 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2006, October 9-15, 2006, Beijing, China. pages 4245-4251, IEEE, 2006. [doi]
Abstract is missing.