Test Cost Reduction Methodology for InFO Wafer-Level Chip-Scale Package

Kai-li Wang, Bing-Yang Lin, Cheng-Wen Wu, Mincent Lee, Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Test Cost Reduction Methodology for InFO Wafer-Level Chip-Scale Package. IEEE Design & Test of Computers, 34(3):50-58, 2017. [doi]

Authors

Kai-li Wang

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Bing-Yang Lin

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Cheng-Wen Wu

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Mincent Lee

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Hao Chen

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Hung-Chih Lin

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Ching-Nen Peng

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Min-Jer Wang

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