Zhongxu Wang, Yangang Wang, Lee Coulbeck, Xiang Li, Wei Gong. Substrate Solder Crack Evaluation and Modelling of Power Module under Passive Cycling. In IECON 2021 - 47th Annual Conference of the IEEE Industrial Electronics Society, Toronto, ON, Canada, October 13-16, 2021. pages 1-6, IEEE, 2021. [doi]
Abstract is missing.