Damage evaluation of wet-chemical silicon-wafer thinning process

Naoya Watanabe, Takumi Miyazaki, Masahiro Aoyagi, Kazuhiro Yoshikawa. Damage evaluation of wet-chemical silicon-wafer thinning process. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

Abstract

Abstract is missing.