Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction - researchr publication

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Kazufumi Watanabe, Akinobu Teramoto, Rihito Kuroda, Shigetoshi Sugawa, Tadahiro Ohmi. Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction. Microelectronics Reliability, 47(2-3):409-418, 2007. [doi]

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