Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints

Xiao-feng Wei, Yu-kun Zhang, Ri-chu Wang, Yan Feng. Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints. Microelectronics Reliability, 53(5):748-754, 2013. [doi]

Abstract

Abstract is missing.