Hsiang-Ting Wen, Yu-Jie Cai, Yang Hsu, Yao-Wen Chang. Via-based Redistribution Layer Routing for InFO Packages with Irregular Pad Structures. In 57th ACM/IEEE Design Automation Conference, DAC 2020, San Francisco, CA, USA, July 20-24, 2020. pages 1-6, IEEE, 2020. [doi]
Abstract is missing.