Thomas Whipple, Thad McCracken. Silicon interposer request-for-quote IC-package Co-design flow. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-7, IEEE, 2011. [doi]
Abstract is missing.