Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Tzong-Lin Wu, Jun Fan, Francesco de Paulis, Chuen-De Wang, Antonio Ciccomancini Scogna, Antonio Orlandi. Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology. IEICE Transactions, 93-B(7):1678-1689, 2010. [doi]

Abstract

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