Cost-driven 3D integration with interconnect layers

Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna Das, Yuan Xie, Chita R. Das, Jian Li. Cost-driven 3D integration with interconnect layers. In Sachin S. Sapatnekar, editor, Proceedings of the 47th Design Automation Conference, DAC 2010, Anaheim, California, USA, July 13-18, 2010. pages 150-155, ACM, 2010. [doi]

Abstract

Abstract is missing.