Yang Xie, Chongxi Bao, Yuntao Liu, Ankur Srivastava. 2.5D/3D Integration Technologies for Circuit Obfuscation. In 17th International Workshop on Microprocessor and SOC Test and Verification, MTV 2016, Austin, TX, USA, December 12-13, 2016. pages 39-44, IEEE Computer Society, 2016. [doi]
Abstract is missing.