Modeling and evaluation for electrical characteristics of through-strata-vias (TSVS) in three-dimensional integration

Zheng Xu, Adam Beece, Kenneth Rose, Tong Zhang, Jian-Qiang Lu. Modeling and evaluation for electrical characteristics of through-strata-vias (TSVS) in three-dimensional integration. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-9, IEEE, 2009. [doi]

Abstract

Abstract is missing.