Device Technology for embedded DRAM utilizing stacked MIM(Metal-Insulator-Metal) Capacitor

Yasushi Yamagata, Hiroki Shirai, Hirotoshi Sugimura, S. Arai, Tomoko Wake, Ken Inoue, Takashi Sakoh, Masato Sakao, Takaho Tanigawa. Device Technology for embedded DRAM utilizing stacked MIM(Metal-Insulator-Metal) Capacitor. In Proceedings of the IEEE 2006 Custom Integrated Circuits Conference, CICC 2006, DoubleTree Hotel, San Jose, California, USA, September 10-13, 2006. pages 421-427, IEEE, 2006. [doi]

Abstract

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