Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system

Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma. Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system. Microelectronics Reliability, 47(8):1280-1287, 2007. [doi]

Abstract

Abstract is missing.