Feasible Assignment of Micro-Bumps in 3D ICs

Jin-Tai Yan, Chia-Heng Yen. Feasible Assignment of Micro-Bumps in 3D ICs. In 16th IEEE International New Circuits and Systems Conference, NEWCAS 2018, Montréal, QC, Canada, June 24-27, 2018. pages 296-299, IEEE, 2018. [doi]

Abstract

Abstract is missing.