Approach on the Life-Prediction of Solder Joint for Electronic Packaging Under Combined Loading

Ping Yang, Dongjing Liu, Yanfang Zhao, Yunqing Tang, Huan Wang. Approach on the Life-Prediction of Solder Joint for Electronic Packaging Under Combined Loading. IEEE Transactions on Reliability, 62(4):870-875, 2013. [doi]

Abstract

Abstract is missing.