The simulation and analysis of stresses field of ceramic die in wire drawing process

Xuefeng Yang, Xiangbo Ze, Hong-Yan Wang, Hui Wang, Hui Zhang. The simulation and analysis of stresses field of ceramic die in wire drawing process. IJMIC, 7(1):80-88, 2009. [doi]

Authors

Xuefeng Yang

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Xiangbo Ze

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Hong-Yan Wang

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Hui Wang

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Hui Zhang

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