Xuefeng Yang, Xiangbo Ze, Hong-Yan Wang, Hui Wang, Hui Zhang. The simulation and analysis of stresses field of ceramic die in wire drawing process. IJMIC, 7(1):80-88, 2009. [doi]
@article{YangZWWZ09,
title = {The simulation and analysis of stresses field of ceramic die in wire drawing process},
author = {Xuefeng Yang and Xiangbo Ze and Hong-Yan Wang and Hui Wang and Hui Zhang},
year = {2009},
doi = {10.1504/IJMIC.2009.027028},
url = {http://dx.doi.org/10.1504/IJMIC.2009.027028},
researchr = {https://researchr.org/publication/YangZWWZ09},
cites = {0},
citedby = {0},
journal = {IJMIC},
volume = {7},
number = {1},
pages = {80-88},
}