Hyunbean Yi, Sandip Kundu. Core Test Wrapper Design to Reduce Test Application Time for Modular SoC Testing. In Cristiana Bolchini, Yong-Bin Kim, Dimitris Gizopoulos, Mohammad Tehranipoor, editors, 23rd IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT 2008), 1-3 October 2008, Boston, MA, USA. pages 412-420, IEEE Computer Society, 2008. [doi]
Abstract is missing.