Microstructures and properties of Bi10Ag high temperature solder doped with Cu element

Limeng Yin, Dong Li, Zongxiang Yao, Gang Wang, Adrian Blackburn. Microstructures and properties of Bi10Ag high temperature solder doped with Cu element. Microelectronics Reliability, 80:79-84, 2018. [doi]

Abstract

Abstract is missing.