Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury. Impacts of different shapes of through-silicon-via core on 3D IC performance. In IEEE International Symposium on Circuits and Systems, ISCAS 2017, Baltimore, MD, USA, May 28-31, 2017. pages 1-4, IEEE, 2017. [doi]
Abstract is missing.