Wei Zhang 0012, Jiale Huang, Shengqi Yang, Pallav Gupta. Case study: Alleviating hotspots and improving chip reliability via carbon nanotube thermal interface. In Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011. pages 1071-1076, IEEE, 2011. [doi]
Abstract is missing.