Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu. An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. In IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022. pages 262-263, IEEE, 2022. [doi]
Abstract is missing.