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Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly

Shuye Zhang, Tiesong Lin, Peng He, Kyung-Wook Paik. Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly. Microelectronics Reliability, 78:181-189, 2017. [doi]

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