Fabrication cost analysis for 2D, 2.5D, and 3D IC designs

Chao Zhang, Guangyu Sun. Fabrication cost analysis for 2D, 2.5D, and 3D IC designs. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

Abstract

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