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Using Existing Reconfigurable Logic in 3D Die Stacks for Test

Fanchen Zhang, Yi Sun, Xi Shen, Kundan Nepal, Jennifer Dworak, Theodore W. Manikas, Ping Gui, R. Iris Bahar, Al Crouch, John C. Potter. Using Existing Reconfigurable Logic in 3D Die Stacks for Test. In 25th IEEE North Atlantic Test Workshop, NATW 2016, Providence, RI, USA, May 9-11, 2016. pages 46-52, IEEE, 2016. [doi]

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