Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via

Meng Zhang, Jian Yang, Yurong He, Fan Yang, Fuhua Yang, Guowei Han, Chaowei Si, Jin Ning. Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via. Sensors, 19(1):93, 2019. [doi]

Abstract

Abstract is missing.