Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders

Ruihong Zhang, Ran Zhao, Fu Guo, Zhidong Xia. Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders. Microelectronics Reliability, 49(3):303-309, 2009. [doi]

Abstract

Abstract is missing.