Co-optimization of fault tolerance, wirelength and temperature mitigation in TSV-based 3D ICs - researchr publication authors

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Yi Zhao, S. Saqib Khursheed, Bashir M. Al-Hashimi, Zhiwen Zhao. Co-optimization of fault tolerance, wirelength and temperature mitigation in TSV-based 3D ICs. In 2016 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016. pages 1-6, IEEE, 2016. [doi]

This author has not been identified. Look up 'Yi Zhao' in GoogleThis author has not been identified. Look up 'S. Saqib Khursheed' in GoogleThis author has not been identified. Look up 'Bashir M. Al-Hashimi' in GoogleThis author has not been identified. Look up 'Zhiwen Zhao' in Google

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