Yi Zhao, S. Saqib Khursheed, Bashir M. Al-Hashimi, Zhiwen Zhao. Co-optimization of fault tolerance, wirelength and temperature mitigation in TSV-based 3D ICs. In 2016 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016. pages 1-6, IEEE, 2016. [doi]
@inproceedings{ZhaoKAZ16,
title = {Co-optimization of fault tolerance, wirelength and temperature mitigation in TSV-based 3D ICs},
author = {Yi Zhao and S. Saqib Khursheed and Bashir M. Al-Hashimi and Zhiwen Zhao},
year = {2016},
doi = {10.1109/VLSI-SoC.2016.7753572},
url = {http://dx.doi.org/10.1109/VLSI-SoC.2016.7753572},
researchr = {https://researchr.org/publication/ZhaoKAZ16},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2016 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016},
publisher = {IEEE},
isbn = {978-1-5090-3561-8},
}