Zhanwei Zhong, Tom B. Wrigglesworth, Eugene M. Chow, Krishnendu Chakrabarty. Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die Attachment and Rework. In 37th IEEE VLSI Test Symposium, VTS 2019, Monterey, CA, USA, April 23-25, 2019. pages 1-6, IEEE, 2019. [doi]
Abstract is missing.