Yongxin Zhu, Xiaoyan Li, Chao Wang, Ruiting Gao. A new creep-fatigue life model of lead-free solder joint. Microelectronics Reliability, 55(7):1097-1100, 2015. [doi]
@article{ZhuLWG15,
title = {A new creep-fatigue life model of lead-free solder joint},
author = {Yongxin Zhu and Xiaoyan Li and Chao Wang and Ruiting Gao},
year = {2015},
doi = {10.1016/j.microrel.2015.03.019},
url = {http://dx.doi.org/10.1016/j.microrel.2015.03.019},
researchr = {https://researchr.org/publication/ZhuLWG15},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {55},
number = {7},
pages = {1097-1100},
}