Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun 0003, Min Yu, Jing Chen, Min Miao, Yufeng Jin. Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration. In 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2013, Suzhou, China, April 7-10, 2013. pages 155-158, IEEE, 2013. [doi]
Abstract is missing.