SiPROBE - A New Technology for Wafer Probing

Karl F. Zimmermann. SiPROBE - A New Technology for Wafer Probing. In Proceedings IEEE International Test Conference 1995, Driving Down the Cost of Test, Washington, DC, USA, October 21-25, 1995. pages 106-112, IEEE Computer Society, 1995.

Abstract

Abstract is missing.