TSV power supply array electromigration lifetime analysis in 3D ICS

Qiaosha Zou, Tao Zhang, Cong Xu, Yuan Xie. TSV power supply array electromigration lifetime analysis in 3D ICS. In Joseph R. Cavallaro, Tong Zhang 0002, Alex K. Jones, Hai Helen Li, editors, Great Lakes Symposium on VLSI 2014, GLSVLSI '14, Houston, TX, USA - May 21 - 23, 2014. pages 239-240, ACM, 2014. [doi]

Abstract

Abstract is missing.