Table of Contents

• The Next Generation of High Performance, Energy-Efficient Computing: Intel® Xeon® Processors Built on Efficient-CoreDon Soltis, Stephen Robinson. 1-16 [doi]
• Memory-Centric Computing with SK Hynix's Domain-Specific MemoryYongkee Kwon, Guhyun Kim, Nahsung Kim, Woojae Shin, Jongsoon Won, Hyunha Joo, Haerang Choi, Byeongju An, Gyeongcheol Shin, Dayeon Yun, Jeongbin Kim 0005, Changhyun Kim, Ilkon Kim, Jaehan Park, Chanwook Park, Yosub Song, Byeongsu Yang, Hyeongdeok Lee, Seungyeong Park, Wonjun Lee, Seongju Lee, Kyuyoung Kim, DaeHan Kwon, Chunseok Jeong, John Kim, Euicheol Lim, Junhyun Chun. 1-26 [doi]
• A Heterogeneous SoC for Bluetooth LE in 28nmFelicia Guo, Nayiri Krzysztofowicz, Alex Moreno, Jeffrey Ni, Daniel Lovell, Yufeng Chi, Kareem Ahmad, Sherwin Afshar, Josh Alexander, Dylan Brater, Cheng Cao, Daniel Fan, Ryan Lund, Jackson Paddock, Griffin Prechter, Troy Sheldon, Shreesha Sreedhara, Anson Tsai, Eric Wu, Kerry Yu, Daniel Fritchman, Aviral Pandey, Ali Niknejad, Kristofer S. J. Pister, Borivoje Nikolic. 1-11 [doi]
• Shaheen: An Open, Secure, and Scalable RV64 SoC for Autonomous Nano-UAVsLuca Valente, A. Veeran, Mattia Sinigaglia, Yvan Tortorella, Alessandro Nadalini, Nils Wistoff, Bruno Sá, Angelo Garofalo, Rafail Psiakis, M. Tolba, Ari Kulmala, Nimisha Limaye, Ozgur Sinanoglu, Sandro Pinto 0001, Daniele Palossi, Luca Benini, Baker Mohammad, Davide Rossi. 1-12 [doi]
• FABRIC8LABS: Electrochemical Additive Manufacturing (ECAM) For Cooling High Performance ICsIan Winfield, Joseph Madril, Tim Ouradnik, Michael Matthews, Guillermo Romero. 1-18 [doi]
• Samsung PIM/PNM for Transfmer Based AI : Energy Efficiency on PIM/PNM ClusterJin Hyun Kim, Yuhwan Ro, Jinin So, Sukhan Lee, Shinhaeng Kang, YeonGon Cho, Hyeonsu Kim, Byeongho Kim, Kyungsoo Kim, Sangsoo Park, Jin-Seong Kim, Sanghoon Cha, Won-Jo Lee, Jin Jung, Jong Geon Lee, Jieun Lee, Joon Ho Song, SeungWon Lee, Jeonghyeon Cho, Jaehoon Yu, Kyomin Sohn. 1-31 [doi]
• NVIDIA's Resource Transmutable Network Processing ASICKevin Deierling. 1-14 [doi]
• Hummingbird™ Low-Latency Computing EngineMaurice Steinman. 1-20 [doi]
• CSS N2: Arm Neoverse N2 Platform, Delivered to Partners as a Fully Verified, Customizable SubsystemAnitha Kona. 1-23 [doi]
• A Machine Learning Supercomputer with an Optically Reconfigurable Interconnect and Embeddings SupportNorman P. Jouppi, Andy Swing. 1-24 [doi]
• Intel Agilex® 9 Direct RF-Series FPGAs with Integrated 64 Gsps Data ConvertersBen Esposito. 1-35 [doi]
• The First Direct Mesh-to-Mesh Photonic FabricJason Howard. 1-17 [doi]
• PHEP: Paillier Homomorphic Encryption Processors for Privacy-Preserving Applications in Cloud ComputingGuiming Shi, Yi Li, Xueqiang Wang, Zhanhong Tan, Dapeng Cao, Jingwei Cai, Yuchen Wei, Zehua Li, Wuke Zhang, Yifu Wu, Wei Xu, Kaisheng Ma. 1-20 [doi]
• TM) Accelerating Hyperscale Models for Generative AISeungjae Moon, Junsoo Kim, Jung Hoon Kim, Junseo Cha, Gyubin Choi, Seongmin Hong, Joo-Young Kim 0006. 1 [doi]
• Intel® Energy Efficiency ArchitectureEfraim Rotem. 1-17 [doi]
• Exciting Directions for ML Models and the Implications for Computing HardwareJeff Dean, Amin Vahdat. 1-87 [doi]
• Inside the Cerebras Wafer-Scale Cluster: Cerebras SystemsSean Lie. 1-41 [doi]
• Driving Compute Scale-out Performance with Optical I/O Chiplets in Advanced System-in-Package PlatformsMark Wade, Chen Sun 0003, Matthew Sysak, Vladimir Stojanovic, Pooya Tadayon, Ravi Mahajan, Babak Sabi. 1 [doi]
• Supercharged AI Inference on Modern CPUsLawrence Spracklen, Subutai Ahmad. 1-21 [doi]
• ®: A Deep-Sparse AI Inference System-on-Chip for Vision and Large-language ModelsZhibin Xiao. 1-33 [doi]
• ™ 7040 Series: Technology OverviewMahesh Subramon, David Kramer, Indrani Paul. 1-27 [doi]
• AMD Next-Generation FPGA Built from ChipletsDinesh Gaitonde. 1-28 [doi]
• Architecting for Flexibility and Value with Next Gen Intel® Xeon® ProcessorsChris Gianos. 1-15 [doi]
• ™ - An OverviewSrivi Dhruvanarayan, Victor Bittorf. 1-13 [doi]
• A Scalable Multi-Chiplet Deep Learning Accelerator with Hub-Side 2.5D Heterogeneous IntegrationZhanhong Tan, Yifu Wu, Yannian Zhang, Haobing Shi, Wuke Zhang, Kaisheng Ma. 1-17 [doi]
• AMD Next Generation "Zen 4" Core and 4th Gen AMD EPYC™ 9004 Server CPUKai Troester, Ravi Bhargava. 1-25 [doi]
• Hardware for Deep LearningBill Dally. 1-58 [doi]
• IBM NorthPole Neural Inference MachineDharmendra S. Modha, Filipp Akopyan, Alexander Andreopoulos, Rathinakumar Appuswamy, John V. Arthur, Andrew S. Cassidy, Pallab Datta, Michael V. DeBole, Steven K. Esser, Carlos Ortega-Otero, Jun Sawada, Brian Taba, Arnon Amir, Deepika Bablani, Peter J. Carlson, Myron D. Flickner, Rajamohan Gandhasri, Guillaume Garreau, Megumi Ito, Jennifer L. Klamo, Jeffrey A. Kusnitz, Nathaniel J. McClatchey, Jeffrey L. McKinstry, Yutaka Y. Nakamura, Tapan K. Nayak, William P. Risk, Kai Schleupen, Ben Shaw 0001, Jay Sivagnaname, Daniel F. Smith, Ignacio Terrizzano, Takanori Ueda. 1-58 [doi]
• Arm Neoverse V2 platform: Leadership Performance and Power Efficiency for Next-Generation Cloud Computing, ML and HPC WorkloadsMagnus Bruce. 1-25 [doi]
• Qualocmm® Hexagon™ NPUEric Mahurin. 1-19 [doi]