Abstract is missing.
- Comparison of electrical stress-induced charge carrier generation/trapping and related degradation of SiO::2:: and HfO::2::/SiO::2:: gate dielectric stacksPiyas Samanta, Chunxiang Zhu, Mansun Chan. 1907-1914 [doi]
- Observation and mechanism explanation of the parasitic charge pumping currentMingzhi Dai, Kinleong Yap. 1915-1919 [doi]
- Detailed investigation of the effects of La and Al content on the electrical characteristics and reliability properties of La-Al-O gate dielectricsMasamichi Suzuki, Masato Koyama, Atsuhiro Kinoshita. 1920-1923 [doi]
- Charge trapping and reliability characteristics of ultra-thin HfYO::x:: films on n-GaAs substratesP. S. Das, A. Biswas. 1924-1930 [doi]
- Investigation on the abnormal resistive switching induced by ultraviolet light exposure based on HfOx filmKow-Ming Chang, Wen-Hsien Tzeng, Kou-Chen Liu, Yi-Chun Chan, Chun-Chih Kuo. 1931-1934 [doi]
- Investigation of the shift of hot spot in lateral diffused LDMOS under ESD conditionsQinsong Qian, Weifeng Sun, Jing Zhu, Longxing Shi. 1935-1941 [doi]
- A comparative study of self-heating effect of nMOSFETs fabricated on SGOI and SGSOAN substratesHongxia Liu, Bin Li, Jin Li, Bo Yuan. 1942-1950 [doi]
- Characteristics degradation of the SiGe HBT under electromagnetic field stressA. Alaeddine, M. Kadi, K. Daoud, B. Beydoun. 1961-1966 [doi]
- Reliability of aluminum-bearing ohmic contacts to SiC under high current densityBrian P. Downey, Suzanne E. Mohney, Trevor E. Clark, Joseph R. Flemish. 1967-1972 [doi]
- Fabrication and enhanced field emission properties of novel silicon nanostructuresSrikanth Ravipati, Chang-Jung Kuo, Jiann Shieh, Cheng-Tung Chou, Fu-Hsiang Ko. 1973-1976 [doi]
- Temperature stability of electro-thermally and piezoelectrically actuated silicon carbide MEMS resonatorsG. S. Wood, I. Gual, P. Parmiter, R. Cheung. 1977-1983 [doi]
- Influence of substrate temperature to prepare (1 0 3) oriented AlN filmsMaw-Shung Lee, Sean Wu, Shih-Bin Jhong, Kuan-Ting Liu, Ruyen Ro, Chia-Chi Shih, Zhi-Xun Lin, Kang-I. Chen, Shou-Chang Cheng. 1984-1987 [doi]
- Study of thinned Si wafer warpage in 3D stacked wafersYoungrae Kim, Sung-Keun Kang, Sarah Eunkyung Kim. 1988-1993 [doi]
- Thermomechanical reliability characterization of a handheld product in accelerated tests and use environmentJ. S. Karppinen, J. Li, Toni T. Mattila, Mervi Paulasto-Kröckel. 1994-2000 [doi]
- Analysis of electrically conductive silver ink on stretchable substrates under tensile loadSari Merilampi, Toni Björninen, Veikko Haukka, Pekka Ruuskanen, Leena Ukkonen, Lauri Sydänheimo. 2001-2011 [doi]
- Application of RPN analysis to parameter optimization of passive componentsK. S. Chen, C.-C. Wang, C. H. Wang, C. F. Huang. 2012-2019 [doi]
- Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particlesYaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li. 2020-2025 [doi]
- Laser moiré interferometry for fatigue life prediction of lead-free soldersKrishna Tunga, Suresh K. Sitaraman. 2026-2036 [doi]
- Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive loadTz-Cheng Chiu, Jyun-Ji Lin, Hung-Chun Yang, Vikas Gupta. 2037-2050 [doi]
- Effect of nano Al::2::O::3:: additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu padsTama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung. 2051-2058 [doi]
- Numerical study of ductile failure morphology in solder joints under fast loading conditionsY.-L. Shen, K. Aluru. 2059-2070 [doi]
- Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packagesLiang Zhang, Song-bai Xue, Li-li Gao, Zhong Sheng, Sheng-lin Yu, Yan Chen, Wei Dai, Feng Ji, Zeng Guang. 2071-2077 [doi]
- Dynamic flow measurements of capillary underfill through a bump array in flip chip packageSeok Hwan Lee, Jaeyong Sung, Sarah Eunkyung Kim. 2078-2083 [doi]
- 1.8 V-3 GHz CMOS limiting amplifier with efficient frequency compensationJose Maria Garcia del Pozo, Santiago Celma, Aránzazu Otín, I. Lope, J. Urdangarín. 2084-2089 [doi]
- n-Al0.15Ga0.85 N/p-6H-SiC heterostructure and based bipolar transistorYa. I. Alivov, Qian Fan, Xianfeng Ni, S. Chevtchenko, I. B. Bhat, Hadis Morkoç. 2090-2092 [doi]
- Electromechanical controlled phased array dumbbell EBG beam steererJeffrey S. Fu, Dong-Hua Yang, Chin-I. Yeh, Nemai C. Karmakar, Jui-Ching Cheng, Kuo-Sheng Chin, Hsien-Chin Chiu, Jian Kang Xiao. 2093-2097 [doi]