An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method

Haixia Shang, Jianxin Gao, P. Ian Nicholson, Steve Kenny. An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method. Microelectronics Reliability, 51(5):994-1002, 2011. [doi]

Abstract

Abstract is missing.