STIFF: thermally safe temperature effect inversion aware FinFET based multi-core

Shounak Chakraborty 0001, Vassos Soteriou, Magnus Själander. STIFF: thermally safe temperature effect inversion aware FinFET based multi-core. In Luca Sterpone, Andrea Bartolini, Anastasiia Butko, editors, CF '22: 19th ACM International Conference on Computing Frontiers, Turin, Italy, May 17 - 22, 2022. pages 21-29, ACM, 2022. [doi]

@inproceedings{0001SS22,
  title = {STIFF: thermally safe temperature effect inversion aware FinFET based multi-core},
  author = {Shounak Chakraborty 0001 and Vassos Soteriou and Magnus Själander},
  year = {2022},
  doi = {10.1145/3528416.3530223},
  url = {https://doi.org/10.1145/3528416.3530223},
  researchr = {https://researchr.org/publication/0001SS22},
  cites = {0},
  citedby = {0},
  pages = {21-29},
  booktitle = {CF '22: 19th ACM International Conference on Computing Frontiers, Turin, Italy, May 17 - 22, 2022},
  editor = {Luca Sterpone and Andrea Bartolini and Anastasiia Butko},
  publisher = {ACM},
  isbn = {978-1-4503-9338-6},
}