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Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics

Muhammad Aamir, Riaz Muhammad, Naseer Ahmed, Muhammad Waqas. Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics. Microelectronics Reliability, 78:311-318, 2017. [doi]

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Muhammad Aamir

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Riaz Muhammad

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Naseer Ahmed

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Muhammad Waqas

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