Syed Mujahid Abbas, Qiang Yu, Michael G. Pecht. Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow. IEEE Access, 11:142487-142494, 2023. [doi]
@article{AbbasYP23,
title = {Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow},
author = {Syed Mujahid Abbas and Qiang Yu and Michael G. Pecht},
year = {2023},
doi = {10.1109/ACCESS.2023.3342906},
url = {https://doi.org/10.1109/ACCESS.2023.3342906},
researchr = {https://researchr.org/publication/AbbasYP23},
cites = {0},
citedby = {0},
journal = {IEEE Access},
volume = {11},
pages = {142487-142494},
}