TSV stress-aware performance and reliability analysis

Muhammad Ali, Mohammad A. Ahmed, Malgorzata Chrzanowska-Jeske. TSV stress-aware performance and reliability analysis. In 19th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2012, Seville, Spain, December 9-12, 2012. pages 737-740, IEEE, 2012. [doi]

@inproceedings{AliAC12,
  title = {TSV stress-aware performance and reliability analysis},
  author = {Muhammad Ali and Mohammad A. Ahmed and Malgorzata Chrzanowska-Jeske},
  year = {2012},
  doi = {10.1109/ICECS.2012.6463649},
  url = {http://dx.doi.org/10.1109/ICECS.2012.6463649},
  researchr = {https://researchr.org/publication/AliAC12},
  cites = {0},
  citedby = {0},
  pages = {737-740},
  booktitle = {19th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2012, Seville, Spain, December 9-12, 2012},
  publisher = {IEEE},
  isbn = {978-1-4673-1259-2},
}