Value-at-Risk and Expected Shortfall in Technology Hardware and Equipment Industry Using Fuzzy Model

Mayca Joy M. Amante, John Paulo A. Calinisan, Vicente L. Co, Venusmar C. Quevedo, Francispito P. Quevedo. Value-at-Risk and Expected Shortfall in Technology Hardware and Equipment Industry Using Fuzzy Model. In TENCON 2018 - 2018 IEEE Region 10 Conference, Jeju, South Korea, October 28-31, 2018. pages 2539-2544, IEEE, 2018. [doi]

Authors

Mayca Joy M. Amante

This author has not been identified. Look up 'Mayca Joy M. Amante' in Google

John Paulo A. Calinisan

This author has not been identified. Look up 'John Paulo A. Calinisan' in Google

Vicente L. Co

This author has not been identified. Look up 'Vicente L. Co' in Google

Venusmar C. Quevedo

This author has not been identified. Look up 'Venusmar C. Quevedo' in Google

Francispito P. Quevedo

This author has not been identified. Look up 'Francispito P. Quevedo' in Google