Tong An, Fei Qin. Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates. Microelectronics Reliability, 54(5):932-938, 2014. [doi]
@article{AnQ14,
title = {Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates},
author = {Tong An and Fei Qin},
year = {2014},
doi = {10.1016/j.microrel.2014.01.008},
url = {http://dx.doi.org/10.1016/j.microrel.2014.01.008},
researchr = {https://researchr.org/publication/AnQ14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {5},
pages = {932-938},
}